The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

May. 22, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tadahiko Sakai, Osaka, JP;

Hideki Eifuku, Osaka, JP;

Koji Motomura, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 1/0373 (2013.01); H05K 1/147 (2013.01); H05K 3/323 (2013.01); H01L 2224/293 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/9211 (2013.01); H01L 2924/351 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0218 (2013.01); H05K 2201/0221 (2013.01); H05K 2201/0233 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/0425 (2013.01); H05K 2203/0465 (2013.01);
Abstract

Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.


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