Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Namics Corporation

Hideki Eifuku

Tadahiko Sakai

Koji Motomura

Mitsuru Ozono

Yoshiyuki Wada

Hiroki Maruo

Shoji Sakemi

Teruaki Nishinaka

Osamu Suzuki

Hironori Munakata

Satomi Kawamoto

Wanyu Tie

Kouji Motomura

Provided is a circuit board interconnection structure including: a first circuit board including a first substrate and a first electrode formed on a surface of the first substrate; a second circuit board including a second substrate and a second electrode formed on a surface of the second substrate; one or more joining portions formed of a metal-containing conductive material for joining the first and second electrodes, interposed between the first and second electrodes; and a reinforcing resin portion for reinforcing the one or more joining portions. The first electrode is a transparent electrode including a metal oxide film. A first abutting portion of the joining portion abutting the first electrode, is formed by adhesional wetting of the first electrode with the conductive material.

Circuit board interconnection structure and circuit board interconnection method

Provided is an electronic component mounting method including the steps of: placing an electronic component having a primary surface on which a first electrode is formed, on a circuit member having a primary surface on which a second electrode corresponding to the first electrode is formed, with solder and a bonding material including a thermosetting resin interposed between the first and second electrodes; subjecting the thermosetting resin to a first heating at a temperature lower than the melting point of the solder and thus causing the resin to cure, while pressing the electronic component against the circuit member, and then releasing pressure applied for the pressing; and subjecting the solder interposed between the first and second electrodes to a second heating with the pressure released, and thus melting the solder to electrically connect the first and second electrodes.

Electric component mounting method

A manufacturing method of an electronic component including a circuit component provided with plural first electrodes in an end, and a substrate provided with plural second electrodes includes: pressing a part of a second surface of an inside of a second edge of the circuit component in the end to the substrate by a press attaching surface of the press attaching tool with an adhesive arranged between the circuit component and the substrate; making a part of the adhesive reach the second surface to cover at least a part of the second edge by the pressing; and curing the adhesive between the end and the substrate and the part of the adhesive covering the at least the part of the second edge.

Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component

Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

Electrode joining method, production method of electrode joined structure

Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Component-mounted structure

It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. When a first connection terminal groupformed on a connection areaof a rigid boardis connected to a flexible boardwhere a second connection terminal grouphas been formed by employing a thermosetting resin in an electrically conductive manner, since a connection areawhich is heated in a step for thermally hardening the thermosetting resin is locally preheated, moisture, and oils and fats contained in the connection areaamong such moisture, and oils and fats, which have been absorbed in the rigid boardare dehumidified. Thereafter, the thermosetting resin interposed between the first connection terminal groupand the second connection terminal groupis thermally hardened. Since the connection areais locally preheated, the dehumidification can be carried out within a short time without giving a thermal influence to an electronic componentwhich has already been mounted on the rigid board

Connecting method of electronic component

A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.

Substrate backing device and substrate thermocompression-bonding device

Disclosed are an electronic component mounting system and an electronic component mounting method capable of ensuring high connection reliability. An electronic component mounting system () includes a component mounting section which includes a solder printing device (M), a coating/inspection device (M), a component mounting device (M), and a reflow device (M), and mounts an electronic component on a main substrate (), and a substrate connection section which includes a bonding material supply/substrate mounting device (M) and a thermal compression device (M), and connects the main substrate () with the component mounted thereon and a module substrate () to each other. A configuration is used in which a substrate conveying mechanism () of the reflow device (M) on the lowermost stream side of the component mounting section and a substrate conveying mechanism () of the bonding material supply/substrate mounting device (M) of the substrate connection section are connected directly to each other or are linked to each other by a conveying path through another conveying means. Thus, the main substrate () after reflow can be transferred immediately to a substrate connection step, and the generation of a void in the connection portion due to moisture being evaporated in the substrate connection step can be excluded.

Electronic component mounting system and electronic component mounting method

Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system () includes a solder printing device (M), a coating/inspection device (M), a component mounting device (M), a bonding material supply/substrate mounting device (M), and a reflow device (M). The electronic component mounting system () mounts an electronic component on a main substrate () and connects a module substrate () to the main substrate (). A cream solder is printed on the main substrate () to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (), and a second connection portion of the module substrate () is landed on the first connection portion through the bonding material. Thereafter, the main substrate () is carried in the reflow device (M) and heated in the same reflow step to solder-bond the electronic component onto the main substrate () and to bond the second connection portion of the module substrate () and the first connection portion of the main substrate () together by the bonding material.

To provide a components joining method and a components joining structure which can realize joining of components while securing conduction at a low electrical resistance with high reliability. In a construction in which by using a solder paste containing solder particlesin a thermosetting resin, a rigid substrateand a flexible substrateare bonded by the thermosetting resin, and a first terminaland a second terminalare electrically connected by the solder particles, a blending ratio of an activator of the thermosetting resinin the solder paste is properly set and oxide film removed portions, andare partially formed in oxide films, andof the first terminal, the second terminal, and the solder particles. Thereby, the first terminaland the second terminalare electrically conducted by solder bonding the solder particlesto both the first terminaland the second terminalvia the oxide film removed portionsand, and while fusion of the solder particleswith each other is prevented in the thermosetting resin, connection of components at a low electrical resistance is realized with high reliability.

Components joining method and components joining structure

In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are mixed in thermosetting resin has been applied onto the rigid substrate so as to cover the electrode, the flexible substrate is put on the rigid substrate and heat-pressed, whereby there are formed a resin part that bonds the both substrates by thermosetting of the thermosetting resin, and a solder part which is surrounded by the resin part and has narrowed parts in which the peripheral surface is narrowed inward in the vicinity of the terminal surface and in the vicinity of the electrode surface. Hereby, the solder parts are soldered to the electrodes and the terminal at acute contact angles so that the production of shape-discontinuities which lowers fatigue strength can be eliminated.

Electronic component soldering structure and electronic component soldering method

The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.

Electronic components mounting adhesive and electronic components mounting structure

By an electronic component mounting method for electrically connecting bumps to board electrodes, in a contact process for placing a thermosetting resin in a liquid glob state on the board surface and bringing the lower surface of the electronic component into contact with the thermosetting resin, the bumps are pressurized against the electrodes in positional alignment in a liquid glob distribution state where one portion of the liquid glob is arranged inside an electronic component mounting region and a remaining portion greater in liquid measure than the one portion is arranged outside the electronic component mounting region. The thermosetting resin enters into a gap between the electronic component and the board by capillarity in a thermocompression bonding process. This prevents voids occurring in the sealing resin, reinforces bonded portions of bumps and electrodes with thermally cured thermosetting resin, thereby preventing bonded portion breakage due to thermal stress generated during cooling.

Electronic component mounting method

A method for connecting a first terminal arrayprovided in a connection portionof a first electric component and a second terminal arrayprovided in a connection portionof a second electric component to each other in such a manner that electric continuity is established between them has two steps, that is, a step of tentatively fixing the two connection portionsandwith each other whose terminal arraysandare positioned with respect to each other by soldering them with solder particlesusing a paste-like anisotropic conductive adhesivein which the solder particlesand conductive particlesare dispersed in a thermosetting resin, and a step of finally fixing the two connection portionsandwith each other with the thermosetting resinthat has been set thermally. This prevents positional deviation from occurring between the two terminal arraysandduring a transport from a tentative fixing apparatus to a final fixing apparatus.

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Fukuoka, Japan

Hideki Eifuku