Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Namics Corporation

Matshushita Electric Industrial Co., Ltd.

Tadahiko Sakai

Hideki Eifuku

Shoji Sakemi

Koji Motomura

Yoshiyuki Wada

Tadashi Maeda

Mitsuru Ozono

Teruaki Nishinaka

Hiroki Maruo

Yuki Yoshioka

Seiichi Yoshinaga

Shinichi Kuroki

Shouzi Sakemi

Shingo Okamura

Hiroshi Haji

Kiyoshi Arita

Masayuki Mantani

Makoto Okazaki

Arata Kishi

Teruaki Kasai

Osamu Suzuki

Kazuo Arikado

Kazuhiro Noda

Tsubasa Saeki

Shinji Sasaguri

Satomi Kawamoto

Kouji Motomura

Takstoshi Ishikawa

Kenichi Takakura

An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.

Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate

A mounting substrate manufacturing method for soldering a terminal of an electronic component to a landof a substrateincludes: a paste disposing step of disposing a solder paste on the land; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated areacoated with solder, on the land; a breaking step of breaking a residue covering a surface of the precoated areaby pressing a toolagainst the precoated area; a flux disposing step of disposing a flux F on the precoated area; a component placement step of placing an electronic component on the substrate, with the terminal of the electronic component aligned with the precoated area; and a reflow step of heating the substrateto melt the precoated area, to solder the terminal to the land. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

Mounting board manufacturing method and flux coating device

A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film () in such a manner as to cover a plurality of solder precoats () formed on a plurality of lands () on a substrate and an antioxidation film () formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components () on the plurality of solder precoats () via the antioxidation film () and the temporary fixing film (); and a step (iii) of soldering the plurality of electronic components () to the lands () by melting the plurality of solder precoats (). The antioxidation film () contains a first thermoplastic resin. The temporary fixing film () contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.

Method for producing electronic component mounted substrate

A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Connection structure of circuit member, connection method, and connection material

Disclosed is a system for mounting a flexible first substrate having a first connection region provided with a first electrode group, on a second substrate having a second connection region provided with a second electrode group. The system includes: a stage configured to support the second substrate; a unit for supplying a bonding material including conductive particles and a thermosetting resin, to at least one of the first and second electrode groups; a unit for placing the first substrate on the second substrate via the bonding material and a unit for successively performing a joining process by pressing a first electrode toward a second electrode and curing the thermosetting resin, using a heating tool, while moving the tool to a processing position of another first electrode not yet subjected to the joining process.

Electrode joining method, production method of electrode joined structure

Disclosed is a component-mounted structure including a first object having a plurality of first electrodes, a second object as an electronic component having second electrodes, a joint portion joining the plurality of first electrodes and the corresponding second electrodes to each other, and a resin-reinforcing portion. The joint portion has a core including at least one of a first metal and a resin particle, and a layer of an intermetallic compound of the first metal and a second metal having a low melting point. The resin-reinforcing portion includes a particulate matter including the core and the intermetallic compound, in a portion except between the first and second electrodes. An amount of the particulate matter included in the portion is 0.1 to 10 vol %.

Component-mounted structure

An electronic component mounting method including the steps of: providing a first electronic component having a principal surface provided with a plurality of bumps; providing a substrate having a placement area provided with a plurality of first electrodes corresponding to the plurality of bumps; applying flux to the plurality of bumps; applying flux to at least one of the first electrodes adjacent to at least one reinforcement position set on a peripheral portion of the placement area; dispensing a thermosetting resin onto the reinforcement position, and at least partially coating the first electrode adjacent to the reinforcement position, with the thermosetting resin; placing the first electronic component on the substrate such that the bumps land on the corresponding first electrodes, and thus bringing the thermosetting resin into contact with a peripheral edge portion of the first electronic component; and heating the substrate with the first electronic component placed thereon.

Electronic component mounting method

Disclosed is an electronic component-mounted structure including: a substrate, a conductive wiring pattern formed on a surface of the substrate, and an electronic component having an external terminal and being placed on the surface of the substrate at a mounting position including a terminal joint position of the conductive wiring pattern. The external terminal is joined to the conductive wiring pattern at the terminal joint position such that the external terminal is embedded in the conductive wiring pattern. Therefore, the junction between the external terminal and the conductive wiring pattern can have a high strength as compared with that obtained by joining the external terminal of the electronic component to the conductive wiring pattern merely on the surface of the conductive wiring pattern.

Electronic component-mounted structure, IC card and COF package

It is to provide an electronic component connecting method capable of performing dehumidification within a short time without giving a thermal influence to an electronic component which has already been mounted on a wiring board. When a first connection terminal groupformed on a connection areaof a rigid boardis connected to a flexible boardwhere a second connection terminal grouphas been formed by employing a thermosetting resin in an electrically conductive manner, since a connection areawhich is heated in a step for thermally hardening the thermosetting resin is locally preheated, moisture, and oils and fats contained in the connection areaamong such moisture, and oils and fats, which have been absorbed in the rigid boardare dehumidified. Thereafter, the thermosetting resin interposed between the first connection terminal groupand the second connection terminal groupis thermally hardened. Since the connection areais locally preheated, the dehumidification can be carried out within a short time without giving a thermal influence to an electronic componentwhich has already been mounted on the rigid board

Connecting method of electronic component

There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains:

Flux for soldering and soldering process

A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.

Substrate backing device and substrate thermocompression-bonding device

Disclosed are an electronic component mounting system and an electronic component mounting method capable of ensuring high connection reliability. An electronic component mounting system () includes a component mounting section which includes a solder printing device (M), a coating/inspection device (M), a component mounting device (M), and a reflow device (M), and mounts an electronic component on a main substrate (), and a substrate connection section which includes a bonding material supply/substrate mounting device (M) and a thermal compression device (M), and connects the main substrate () with the component mounted thereon and a module substrate () to each other. A configuration is used in which a substrate conveying mechanism () of the reflow device (M) on the lowermost stream side of the component mounting section and a substrate conveying mechanism () of the bonding material supply/substrate mounting device (M) of the substrate connection section are connected directly to each other or are linked to each other by a conveying path through another conveying means. Thus, the main substrate () after reflow can be transferred immediately to a substrate connection step, and the generation of a void in the connection portion due to moisture being evaporated in the substrate connection step can be excluded.

Electronic component mounting system and electronic component mounting method

The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four corners of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.

Electronic component mounting structure

An electronic element unit () includes an electronic element () having a plurality of connecting terminals () on a lower surface thereof, a circuit board () having a plurality of electrodes () corresponding to the connecting terminals () on an upper surface thereof. The connecting terminals () and the electrodes () are connected by solder bumps (), and the electronic element () and the circuit board () are partly bond by a resin bond part () made of a thermosetting material of a thermosetting resin, and a metal powder () is included in the resin bond parts () in a dispersed state. The metal powder () has a melting point lower than a temperature at which the resin bond parts () are heated when a work (a repairing work) is carried out for removing the electronic element () from the circuit board ().

Electronic element unit and reinforcing adhesive agent

A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Growing community of inventors

Fukuoka, Japan

Tadahiko Sakai