The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2025

Filed:

Oct. 07, 2021
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Kadoma, JP;

Inventors:

Yuki Yoshioka, Fukuoka, JP;

Tadahiko Sakai, Fukuoka, JP;

Tadashi Maeda, Fukuoka, JP;

Shingo Okamura, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/20 (2006.01); C09J 11/06 (2006.01); C09J 193/04 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/305 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); C09J 11/06 (2013.01); C09J 193/04 (2013.01); H05K 3/3442 (2013.01); B23K 2101/42 (2018.08);
Abstract

An adhesive for temporarily fixing an electronic component to a solder precoat covered at least partially with an organic film, the adhesive including a principal resin, and a solvent dissolving the principal resin. The content of the solvent is 25 mass % or more and 40 mass % or less, and the organic film dissolves in the solvent when the solder precoat is melted. According thereto, the formation of an oxide film on the surface of the solder precoat can be suppressed, and poor connection between the electrode having the solder precoat and the electronic component can be suppressed.


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