The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Jan. 27, 2005
Applicants:
Tadashi Maeda, Kadoma, JP;
Tadahiko Sakai, Kadoma, JP;
Inventors:
Tadashi Maeda, Kadoma, JP;
Tadahiko Sakai, Kadoma, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0244 (2013.01); B23K 35/025 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/36 (2013.01); H01L 21/6835 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H05K 3/3489 (2013.01); B23K 35/3613 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/11003 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H05K 2201/0215 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/014 (2013.01); H01L 2224/11822 (2013.01); H01L 2924/00013 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01);
Abstract
There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: