The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Feb. 21, 2022
Panasonic Intellectual Property Management Co., Ltd., Kadoma, JP;
Shingo Okamura, Fukuoka, JP;
Tadashi Maeda, Fukuoka, JP;
Yuki Yoshioka, Fukuoka, JP;
Tadahiko Sakai, Fukuoka, JP;
Abstract
A disclosed method for manufacturing an electronic-component-mounted substrate includes: a step (i) of forming a temporary fixing film () in such a manner as to cover a plurality of solder precoats () formed on a plurality of lands () on a substrate and an antioxidation film () formed in such a manner as to cover the solder precoats; a step (ii) of disposing a plurality of electronic components () on the plurality of solder precoats () via the antioxidation film () and the temporary fixing film (); and a step (iii) of soldering the plurality of electronic components () to the lands () by melting the plurality of solder precoats (). The antioxidation film () contains a first thermoplastic resin. The temporary fixing film () contains an activating agent and a second thermoplastic resin. The softening point of the first thermoplastic resin is equal to or lower than the softening point of the second thermoplastic resin.