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For the Inventor, By the Inventor

Annaka, Japan

Shohei Tagami

This inventor holds 34 USPTO granted patents and 5 published patent applications and 22 EPO patents, primarily in Wafer Processing Technology. Top assignees: Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical C O., Ltd., Shin-Etsu Chemical Ltd.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shohei Tagami. Retrieved from https://idiyas.com/inventor/shohei-tagami

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 34 

% Patents Active = 76.5

 

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 63(Granted Patents)


Company Filing History:

goldMedal32 out of 5,989 
 
Shin-Etsu Chemical Co., Ltd.
 patents
silverMedal1 out of 42 
 
Shin-Etsu Chemical C O., Ltd.
 patents
bronzeMedal1 out of 157 
 
Shin-Etsu Chemical Ltd.
 patents

Years Active: 2009-2026

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Areas of Expertise:
Temporary Adhesive
Wafer Processing
Thin Wafer Manufacturing
Wafer Laminate
Semiconductor Device
Chemical Composition
Pattern Formation
Substrate Cleaning
Circuit Substrate
Photocurable Composition
Polyimide Resin
Organopolysiloxane
34 patents (USPTO):Explore Patents
1. 12685086 - Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing (2026-07-14),
2. 12322637 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2025-06-03),
3. 12187989 - Cleaning solution for temporary adhesive for substrates, substrate cleaning method, and cleaning method for support or substrate (2025-01-07),
4. 11970639 - Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer (2024-04-30),
5. 10991611 - Wafer processing laminate and method for processing wafer (2021-04-27),
6. 10854496 - Circuit substrate processing laminate and method for processing circuit substrate (2020-12-01),
7. 10242902 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2019-03-26),
8. 10147632 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2018-12-04),
9. 10128143 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2018-11-13),
10. 10115622 - Wafer processing laminate and method for processing wafer (2018-10-30),
11. 10106713 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2018-10-23),
12. 9934996 - Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method (2018-04-03),
13. 9887118 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2018-02-06),
14. 9653335 - Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method (2017-05-16),
15. 9646868 - Wafer temporary bonding method and thin wafer manufacturing method (2017-05-09),

Title: **Innovator Spotlight: Shohei Tagami**

Introduction

Shohei Tagami, an accomplished inventor based in Annaka, Japan, has made significant contributions to the field of adhesive solutions and wafer processing technologies. With a remarkable portfolio of 32 patents, Tagami continues to push the boundaries of innovation in his industry.

Latest Patents

Tagami's recent patents exemplify his expertise and innovative spirit. His notable inventions include a cleaning solution for temporary adhesives for substrates, which comprises tetrabutylammonium fluoride, dimethyl sulfoxide, and a specific liquid compound. The formulation is designed to maximize effectiveness, with the tetrabutylammonium fluoride content ideally between 1% and 15%, and the dimethyl sulfoxide component ranging from 5% to 30%.

Additionally, Tagami has patented a temporary adhesive for wafer processing, utilizing a photocurable silicone resin composition that includes a non-functional organopolysiloxane. This invention focuses on provisionally bonding wafers to supports and offers a method for producing thin wafers efficiently.

Career Highlights

Currently employed at Shin-Etsu Chemical Co., Ltd., Tagami has established himself as a leader in the field of adhesive materials and processes. His extensive research and development work have garnered attention within the scientific community and the industry alike, exemplifying a commitment to advancing technology in wafer processing.

Collaborations

Throughout his career, Tagami has collaborated with notable coworkers, including Michihiro Sugo and Hideto Kato. These partnerships have further enriched his research endeavors and contributed to the collective goal of advancing adhesive technologies.

Conclusion

Shohei Tagami stands out as a prominent inventor whose innovative contributions continue to influence the fields of adhesives and processing technologies. His dedication to research, coupled with a robust patent portfolio, positions him as a key figure in the future developments of these essential materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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