The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Mar. 27, 2019
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Shohei Tagami, Annaka, JP;
Michihiro Sugo, Takasaki, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
A circuit substrate processing laminate has, sequentially in the order of a support, a temporary adhesive material layer releasably laminated on the support, and a circuit substrate. The circuit substrate has a front surface on which a circuit is formed and a back surface to be processed. The temporary adhesive material layer is releasably laminated to the front surface, and is composed of a thermosetting siloxane polymer layer laminated on the support, after cured, has a first peeling force of 10 to 500 mN/25 mm as measured by a 180° peel test. The first peeling force is required for peeling the polymer layer from an interface with the support. The polymer layer, after cured, has a second peeling force of 50 to 1000 mN/25 mm as measured by the 180° peel test. The second peeling force is required for peeling the polymer layer from an interface with the circuit substrate.