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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9653335 B1

PDFFull Text
Date of Patent:
May. 16, 2017

Filed:

Jul. 24, 2012

Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

Applicants:

Hideto Kato, Annaka, JP;

Michihiro Sugo, Annaka, JP;

Shohei Tagami, Annaka, JP;

Inventors:

Hideto Kato, Annaka, JP;

Michihiro Sugo, Annaka, JP;

Shohei Tagami, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Michael B Nelson

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 183/04 (2006.01); C08G 77/52 (2006.01); C09J 183/14 (2006.01); C08G 77/04 (2006.01); C08G 77/14 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C08G 77/52 (2013.01); C09J 183/04 (2013.01); C09J 183/14 (2013.01); C08G 77/04 (2013.01); C08G 77/14 (2013.01); C08G 77/70 (2013.01); H01L 2221/68327 (2013.01); Y10T 428/2848 (2015.01); Y10T 428/31515 (2015.04); Y10T 428/31663 (2015.04);
Abstract

A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.

Find Patent Forward Citations

Kato, Hideto. (2017). Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method (U.S. Patent No. 9653335). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9653335

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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