Hideto Kato

This inventor holds 97 USPTO granted patents and 1 published patent application and 41 EPO patents, primarily in Wafer Processing (CPC class H01L21-6835). Top assignees: Shin-Etsu Chemical Co., Ltd., Menicon Co., Ltd., Shin-Estu Chemical Co., Ltd.. Active years: 1987-2022.

USPTO Granted Patents = 97 (Patent Applications = 1)

% Patents Active = 84.5

EPO Patents = 41 (Patent Applications = 25)

Average Co-Inventor Count = 2.7

ph-index = 11

Forward Citations = 451(Granted Patents)

Forward Citations (Not Self Cited) = 393(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Gunma, JP (1987)
Matsuida, JP (1996)
Matsuida-machi, JP (1996 - 2003)
Usui-gun, JP (2000 - 2003)
Nakakubiki-gun, JP (2006)
Gunma-ken, JP (1997 - 2007)
Niigata, JP (2007)
Niigata-ken, JP (2009)
Annako, JP (2014)
Joetsu, JP (2010 - 2020)
Takasaki, JP (1988 - 2021)
Annaka, JP (2008 - 2022)

Company Filing History:

96 out of 5,989

Shin-Etsu Chemical Co., Ltd.

Shin-Estu Chemical Co., Ltd.

patents

where one patent can have more than one assignee

Years Active: 1987-2022

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Areas of Expertise:

Wafer Processing Laminate

Photo-Curable Resin

Semiconductor Device

Pattern Forming Process

Temporary Adhesive

Silicone Resin

Resin Composition

Thin Wafer Manufacturing

Adhesive Composition

Micro-Structure Manufacturing

Electrical Part Protection

Polymer Composition

97 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11294282 - Epoxy-containing, isocyanurate-modified silicone resin, photosensitive resin composition, photosensitive dry film, laminate, and pattern forming process (2022-04-05),

2. 11262655 - Photosensitive resin composition, photosensitive dry film, and pattern forming process (2022-03-01),

3. 10991611 - Wafer processing laminate and method for processing wafer (2021-04-27),

4. 10982053 - Polymer containing silphenylene and polyether structures (2021-04-20),

5. 10948823 - Laminate and pattern forming method (2021-03-16),

6. 10658314 - Wafer laminate, method for production thereof, and adhesive composition for wafer laminate (2020-05-19),

7. 10553552 - Wafer laminate and method of producing the same (2020-02-04),

8. 10453732 - Wafer laminate and making method (2019-10-22),

9. 10416559 - Film material and pattern forming process (2019-09-17),

10. 10373903 - Laminate and making method (2019-08-06),

11. 10319653 - Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same (2019-06-11),

12. 10297485 - Semiconductor device, making method, and laminate (2019-05-21),

13. 10141272 - Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each having photo-curable resin layer (2018-11-27),

14. 10128143 - Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer (2018-11-13),

15. 10115622 - Wafer processing laminate and method for processing wafer (2018-10-30),

Title: Inventor Hideto Kato: Pioneering Innovations in Annaka

Introduction: Hideto Kato is a renowned inventor hailing from Annaka, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kato's latest patents include advancements in renewable energy technologies, artificial intelligence systems, and sustainable materials.

Career Highlights: With a career spanning over two decades, Kato has worked with leading research institutions and tech companies to develop cutting-edge solutions for complex challenges.

Collaborations: Throughout his career, Kato has collaborated with top engineers, scientists, and designers to bring his inventions to life, fostering a culture of innovation and creativity.

Conclusion: Hideto Kato's passion for pushing the boundaries of technology and his relentless pursuit of excellence continue to inspire the next generation of inventors and innovators worldwide.