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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10115622 B1

PDFFull Text
Date of Patent:
Oct. 30, 2018

Filed:

Nov. 15, 2016

Wafer processing laminate and method for processing wafer

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Shohei Tagami, Annaka, JP;

Michihiro Sugo, Takasaki, JP;

Hideto Kato, Takasaki, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Mary Wilczewski

Int. Cl.
CPC ...
H01L 21/304 (2006.01); H01L 21/683 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); C09J 183/04 (2006.01); C09J 183/10 (2006.01); C09J 183/14 (2006.01); C08G 77/52 (2006.01); C08G 77/04 (2006.01); C08G 77/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 183/04 (2013.01); C09J 183/10 (2013.01); C09J 183/14 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); C08G 77/04 (2013.01); C08G 77/455 (2013.01); C08G 77/52 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

A wafer processing laminate including support, temporary adhesive material layer laminated on the support, and wafer stacked on temporary adhesive material layer, wafer having front surface on which circuit is formed and back surface to be processed, temporary adhesive material layer including first temporary adhesive layer composed of thermoplastic resin layer (A) laminated on front surface of wafer and second temporary adhesive layer composed of thermosetting resin layer (B) laminated on first temporary adhesive layer, thermoplastic resin layer (A) being soluble in cleaning liquid (D) after processing wafer, thermosetting resin layer (B) being insoluble in cleaning liquid (D) after heat curing and capable of absorbing cleaning liquid (D) such that cleaning liquid (D) permeates into layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

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