The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Nov. 23, 2016
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/304 (2006.01); H01L 23/00 (2006.01); C09J 165/00 (2006.01); C09J 183/14 (2006.01); C09D 5/32 (2006.01); C09D 165/00 (2006.01); C09D 183/14 (2006.01); C09J 5/00 (2006.01); C08G 77/52 (2006.01); C08K 5/00 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C08G 77/52 (2013.01); C08K 5/0025 (2013.01); C08L 63/00 (2013.01); C09D 5/32 (2013.01); C09D 165/00 (2013.01); C09D 183/14 (2013.01); C09J 5/00 (2013.01); C09J 165/00 (2013.01); C09J 183/14 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); H01L 24/14 (2013.01); C09J 2203/326 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/0782 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A wafer laminate has an adhesive layer () sandwiched between a transparent substrate () and a water (), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer () includes a first cured resin layer () disposed adjacent the substrate and having light-shielding properties and a second cured resin layer () disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.