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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10373903 B1

PDFFull Text
Date of Patent:
Aug. 06, 2019

Filed:

Mar. 22, 2018

Laminate and making method

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Yasuda, Annaka, JP;

Michihiro Sugo, Annaka, JP;

Hideto Kato, Annaka, JP;

Kazunori Kondo, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

William H Mayo, III

Assistant Examiner:

Krystal Robinson

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/683 (2006.01); C08G 8/04 (2006.01); C09D 161/12 (2006.01); H01L 21/48 (2006.01); C08L 63/00 (2006.01); C23C 14/34 (2006.01); C25D 3/38 (2006.01); C23C 14/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); C08G 8/04 (2013.01); C08L 63/00 (2013.01); C09D 161/12 (2013.01); H01L 21/4846 (2013.01); H01L 21/683 (2013.01); H01L 21/6835 (2013.01); H01L 24/19 (2013.01); H01L 24/50 (2013.01); C23C 14/205 (2013.01); C23C 14/34 (2013.01); C25D 3/38 (2013.01); H01L 23/49866 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/82005 (2013.01);
Abstract

A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a photo-decomposable resin having light-shielding properties and has a transmittance of up to 20% with respect to light of wavelength 355 nm. The laminate is easy to fabricate and has thermal process resistance, the support is easily separated, and a semiconductor package is efficiently produced.

Find Patent Forward Citations

Yasuda, Hiroyuki. (2019). Laminate and making method (U.S. Patent No. 10373903). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10373903

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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