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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10658314 B1

PDFFull Text
Date of Patent:
May. 19, 2020

Filed:

Oct. 10, 2017

Wafer laminate, method for production thereof, and adhesive composition for wafer laminate

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Yasuda, Joetsu, JP;

Michihiro Sugo, Joetsu, JP;

Hideto Kato, Joetsu, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Westerman, Hattori, Daniels & Adrian, LLP

Primary Examiner:

Bo B Jang

Int. Cl.
CPC ...
B32B 7/06 (2019.01); H01L 21/683 (2006.01); C08G 77/50 (2006.01); B32B 15/08 (2006.01); B32B 17/06 (2006.01); C08G 77/52 (2006.01); B32B 7/12 (2006.01); H01L 23/00 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 38/10 (2006.01); B32B 27/20 (2006.01); B32B 27/18 (2006.01); B32B 27/24 (2006.01); B32B 37/12 (2006.01); C09J 163/00 (2006.01); B32B 27/08 (2006.01); C09J 183/10 (2006.01); B32B 37/02 (2006.01); C08G 77/00 (2006.01); B32B 38/00 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 17/064 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/24 (2013.01); B32B 27/26 (2013.01); B32B 27/28 (2013.01); B32B 27/283 (2013.01); B32B 37/02 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); C08G 77/50 (2013.01); C08G 77/52 (2013.01); C08G 77/70 (2013.01); C08G 77/80 (2013.01); C09J 163/00 (2013.01); C09J 183/10 (2013.01); H01L 21/6836 (2013.01); B32B 2037/0092 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/1269 (2013.01); B32B 2038/0016 (2013.01); B32B 2250/03 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2270/00 (2013.01); B32B 2307/40 (2013.01); B32B 2307/412 (2013.01); B32B 2307/414 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/12 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Disclosed herein is a wafer laminate suitable for production of thin wafers and a method for producing the wafer laminate. The wafer laminate can be formed easily by bonding between the support and the wafer and it can be easily separated from each other. It promotes the productivity of thin wafers. The wafer laminate includes a support, an adhesive layer formed on the support, and a wafer which is laminated on the adhesive layer in such a way that that surface of the wafer which has the circuit surface faces toward the adhesive layer, wherein the adhesive layer is a cured product of an adhesive composition composed of resin A and resin B, the resin A having the light blocking effect and the resin B having the siloxane skeleton.

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