The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Apr. 22, 2021
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 7/38 (2018.01); C09J 11/08 (2006.01); C09J 183/06 (2006.01); H01L 21/683 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 17/06 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
C09J 183/06 (2013.01); B32B 7/12 (2013.01); C09J 7/38 (2018.01); C09J 11/08 (2013.01); H01L 21/6836 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 17/06 (2013.01); B32B 2038/0016 (2013.01); B32B 2255/26 (2013.01); B32B 2307/748 (2013.01); B32B 2457/14 (2013.01);
Abstract
The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.