logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10242902 B1

PDFFull Text
Date of Patent:
Mar. 26, 2019

Filed:

Mar. 03, 2015

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Michihiro Sugo, Takasaki, JP;

Hiroyuki Yasuda, Tomioka, JP;

Shohei Tagami, Annaka, JP;

Masahito Tanabe, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Sophia Nguyen

Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 7/30 (2018.01); C09J 7/40 (2018.01); C09J 7/20 (2018.01); C09J 7/50 (2018.01); C09J 183/04 (2006.01); C08G 77/20 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 7/04 (2019.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/18 (2006.01); B32B 27/26 (2006.01); B32B 37/12 (2006.01); C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 7/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/26 (2013.01); B32B 27/283 (2013.01); B32B 37/12 (2013.01); C08G 77/20 (2013.01); C09J 7/201 (2018.01); C09J 7/203 (2018.01); C09J 7/30 (2018.01); C09J 7/401 (2018.01); C09J 7/403 (2018.01); C09J 7/50 (2018.01); C09J 183/04 (2013.01); H01L 21/6835 (2013.01); B32B 2037/1269 (2013.01); B32B 2250/03 (2013.01); B32B 2264/00 (2013.01); B32B 2264/02 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2405/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/14 (2013.01); C08G 77/12 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/0715 (2013.01); H01L 2924/10253 (2013.01);
Abstract

A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same.

Find Patent Forward Citations

Loading…