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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10106713 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

Jan. 21, 2015

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Shohei Tagami, Annaka, JP;

Michihiro Sugo, Takasaki, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
B32B 27/28 (2006.01); C09J 183/04 (2006.01); C09J 183/10 (2006.01); C09J 183/14 (2006.01); C08L 83/04 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/304 (2006.01); C08G 77/12 (2006.01); C08G 77/04 (2006.01); C08G 77/50 (2006.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); B32B 27/283 (2013.01); C08L 83/04 (2013.01); C09J 183/10 (2013.01); C09J 183/14 (2013.01); H01L 21/02255 (2013.01); H01L 21/304 (2013.01); H01L 21/6835 (2013.01); C08G 77/04 (2013.01); C08G 77/12 (2013.01); C08G 77/50 (2013.01); C09J 2203/326 (2013.01); H01L 2221/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01);
Abstract

A wafer processing laminate including a support, a temporary adhesive material layer formed on the support, and a wafer, having a circuit-forming front surface and back surface to be processed, laminated on the temporary adhesive material layer, in which the temporary adhesive material layer is composed of a complex temporary adhesive material layer having a three-layered structure including a first temporary adhesive layer composed of a thermoplastic organopolysiloxane polymer layer releasably adhering to the front surface of the wafer, second temporary adhesive layer composed of thermosetting siloxane-modified polymer layer releasably laminated on the first temporary adhesive layer, and third temporary adhesive layer composed of thermosetting siloxane polymer layer releasably laminated on the second temporary adhesive layer and releasably adhering to the support. A temporary adhesive material for a wafer processing facilitates temporary adhesion and separation, and allows separation even when a thin wafer is cut before separation.

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