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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12685086 B1

PDFFull Text
Date of Patent:
Jul. 14, 2026

Filed:

Apr. 26, 2021

Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Tamotsu Oowada, Yokohama, JP;

Shohei Tagami, Annaka, JP;

Mitsuo Muto, Takasaki, JP;

Masahito Tanabe, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
H10P 72/70 (2026.01); C09J 179/08 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); C09J 179/08 (2013.01); C09J 183/04 (2013.01); C09J 2203/326 (2013.01); H10P 72/7412 (2026.01); H10P 72/7416 (2026.01); H10P 72/744 (2026.01);
Abstract

A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.

Find Patent Forward Citations

Oowada, Tamotsu. (2026). Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing (U.S. Patent No. 12685086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12685086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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