The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Apr. 26, 2021
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Tamotsu Oowada, Yokohama, JP;
Shohei Tagami, Annaka, JP;
Mitsuo Muto, Takasaki, JP;
Masahito Tanabe, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); C09J 179/08 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); C09J 179/08 (2013.01); C09J 183/04 (2013.01); C09J 2203/326 (2013.01); H10P 72/7412 (2026.01); H10P 72/7416 (2026.01); H10P 72/744 (2026.01);
Abstract
A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.