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For the Inventor, By the Inventor

Watervliet, NY, United States of America

Sean Xuan Lin

This inventor holds 30 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Fabrication. Top assignees: Globalfoundries Inc., Globalfoundries U.S. Inc., Intermolecular, Inc.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sean Xuan Lin. Retrieved from https://idiyas.com/inventor/sean-xuan-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 66.7

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 161(Granted Patents)


Company Filing History:

goldMedal27 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal2 out of 1,090 
 
Globalfoundries U.S. Inc.
 patents
bronzeMedal1 out of 726 
 
Intermolecular, Inc.
 patents
4. 1 out of 166,351 
 
International Business Machines Corporation
 patents
where one patent can have more than one assignee

Years Active: 2013-2026

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Areas of Expertise:
Semiconductor Device
Self-Forming Barrier
Interconnects
Integrated Circuits
Metal Fill
Pore Stuffing
Low Resistance
Electroless Deposition
Copper-Based Structures
Trench Fill
Magnetic Tunnel Junctions
Patterning Techniques
30 patents (USPTO):Explore Patents
1. RE50914 - Semiconductor device having a self-forming barrier layer at via bottom (2026-06-09),
2. RE49820 - Semiconductor device having a self-forming barrier layer at via bottom (2024-01-30),
3. 10727120 - Controlling back-end-of-line dimensions of semiconductor devices (2020-07-28),
4. 10580696 - Interconnects formed by a metal displacement reaction (2020-03-03),
5. 10573593 - Metal interconnects for super (skip) via integration (2020-02-25),
6. RE47630 - Semiconductor device having a self-forming barrier layer at via bottom (2019-09-30),
7. 10395926 - Multiple patterning with mandrel cuts formed using a block mask (2019-08-27),
8. 10283372 - Interconnects formed by a metal replacement process (2019-05-07),
9. 10181421 - Liner recess for fully aligned via (2019-01-15),
10. 10134580 - Metallization levels and methods of making thereof (2018-11-20),
11. 10109490 - Cobalt interconnects formed by selective bottom-up fill (2018-10-23),
12. 10026687 - Metal interconnects for super (skip) via integration (2018-07-17),
13. 9853110 - Method of forming a gate contact structure for a semiconductor device (2017-12-26),
14. 9831100 - Solution based etching of titanium carbide and titanium nitride structures (2017-11-28),
15. 9805972 - Skip via structures (2017-10-31),

Title: The Innovative Journey of Sean Xuan Lin

Introduction: Sean Xuan Lin, a talented inventor hailing from Watervliet, NY, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Sean Xuan Lin's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a patented method for enhancing the efficiency of solar panels.

Career Highlights: Throughout his illustrious career, Sean Xuan Lin has been recognized for his innovative spirit and dedication to pushing the boundaries of technology. He has received multiple awards for his inventions, including the prestigious Innovation Award at the National Inventors Hall of Fame.

Collaborations: Sean Xuan Lin has collaborated with leading tech companies and research institutions to further develop his inventions and bring them to the market. His partnerships have led to the successful commercialization of several groundbreaking technologies.

Conclusion: Sean Xuan Lin's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor in the tech industry. His contributions continue to inspire future generations of inventors to think outside the box and create solutions that shape the world of tomorrow.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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