The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Aug. 15, 2017
Globalfoundries Inc., Grand Cayman, KY;
Nicholas V. LiCausi, Watervliet, NY (US);
Errol Todd Ryan, Clifton Park, NY (US);
Sean Xuan Lin, Watervliet, NY (US);
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Abstract
Structures for metallization levels of integrated circuits and associated fabrication methods. A first metallization level with a metallization line is formed. A second metallization level is formed over the first metallization level, having two metallization lines and two conductive vias extending from the two metallization lines to the metallization line in the first metallization level. The first metallization line is separated into a first section and a second section disconnected from the first section, so that the first section is connected by one conductive via to one metallization line in the second metallization level, and the second section is connected by the other conductive via to the other metallization line in the second level.