IDiyas

For the Inventor, By the Inventor

Watervliet, NY, United States of America

Nicholas V Licausi

USPTO Granted Patents = 45 

Average Co-Inventor Count = 2.6

ph-index = 12

Forward Citations = 369(Granted Patents)


Company Filing History:

goldMedal40 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal4 out of 927 
 
Globalfoundries U.S. Inc.
 patents
bronzeMedal1 out of 10 
 
Globalfoundaries Inc.
 patents

Years Active: 2013-2024

where 'Filed Patents' based on already Granted Patents

45 patents (USPTO):
1. 12142516 - Self aligned buried power rail (2024-11-12),
2. 11398378 - Metal on metal multiple patterning (2022-07-26),
3. 11309210 - Self aligned buried power rail (2022-04-19),
4. 11114338 - Fully aligned via in ground rule region (2021-09-07),
5. 11101169 - Interconnect structures with airgaps arranged between capped interconnects (2021-08-24),
6. 10832944 - Interconnect structure having reduced resistance variation and method of forming same (2020-11-10),
7. 10818494 - Metal on metal multiple patterning (2020-10-27),
8. 10770392 - Line end structures for semiconductor devices (2020-09-08),
9. 10707119 - Interconnect structures with airgaps and dielectric-capped interconnects (2020-07-07),
10. 10677855 - Structure, method and system for measuring RIE lag depth (2020-06-09),
11. 10622266 - Methods of identifying space within integrated circuit structure as mandrel space or non-mandrel space (2020-04-14),
12. 10580696 - Interconnects formed by a metal displacement reaction (2020-03-03),
13. 10485111 - Via and skip via structures (2019-11-19),
14. 10475692 - Self aligned buried power rail (2019-11-12),
15. 10366919 - Fully aligned via in ground rule region (2019-07-30),

Title: Innovations by Inventor Nicholas V. Licausi

Introduction

Nicholas V. Licausi is an accomplished inventor based in Watervliet, NY, with an impressive portfolio of 25 patents. His contributions primarily focus on advancements in semiconductor technology, showcasing his significant impact in the field through innovative solutions.

Latest Patents

Among his latest patents is the "Self Aligned Buried Power Rail," which involves the development of semiconductor structures and methods for manufacturing these structures. This innovation includes forming fin structures of varying dimensions within a substrate, ultimately resulting in a buried power rail structure filled with conductive metal. His other notable patent, "Interconnect Structures with Airgaps Arranged Between Capped Interconnects," involves the formation of interconnects with cavities that create airgaps, optimizing performance in metallization levels.

Career Highlights

Throughout his career, Nicholas Licausi has worked with prominent companies, including GlobalFoundries Inc. and GlobalFoundries U.S. Inc. His work at these institutions has allowed him to play a vital role in the advancement of semiconductor technologies, reflecting his expertise and innovative spirit in the industry.

Collaborations

Licausi has collaborated with talented individuals such as Errol Todd Ryan and Xunyuan Zhang, contributing to the successful realization of several projects that further the capabilities and efficiency of semiconductor manufacturing.

Conclusion

Nicholas V. Licausi stands out as a prolific inventor whose advancements have influenced the semiconductor industry significantly. His dedication to innovation and collaboration demonstrates the importance of teamwork in the field of technology, ensuring that his contributions will continue to shape the future of semiconductor design and manufacturing.

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