The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 2020

Filed:

Sep. 08, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventor:

Nicholas V. LiCausi, Watervliet, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/50 (2020.01); H01L 23/528 (2006.01); H01L 21/66 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01); G01R 31/26 (2020.01); H01L 23/544 (2006.01); G01R 31/28 (2006.01); H01L 21/3065 (2006.01); H01L 21/3213 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G01R 31/50 (2020.01); G01R 31/2601 (2013.01); G01R 31/2856 (2013.01); H01L 21/3065 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/32136 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 22/12 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 23/5286 (2013.01); H01L 23/544 (2013.01); H01L 22/14 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01);
Abstract

Structures for measuring RIE lag depth of a semiconductor device, including: a first metal layer; a dielectric cap layer on top of the first metal layer; an electrical ground element formed beneath one or more portions of the dielectric cap layer and within the first metal layer, the electrical ground element being electrically grounded; and a second metal layer on top of the dielectric cap layer, the second metal layer having an array of one or more sub-arrays of metal wires, each sub-array being connected to a respective bond pad and having metal wires of a given width; wherein a distance from a bottom surface of the array of metal wires to a top surface of the dielectric cap layer is indicative of RIE lag depth. The disclosure also relates to methods and systems for measuring RIE lag depth and identifying the existence of an electrical short of a semiconductor device.


Find Patent Forward Citations

Loading…