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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10109490 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

Jun. 20, 2017

Cobalt interconnects formed by selective bottom-up fill

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Sean X. Lin, Watervliet, NY (US);

Xunyuan Zhang, Troy, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorneys:

Thompson Hine LLP

Anthony Canale

Primary Examiner:

Chuong A Luu

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/28 (2006.01); H01L 29/66 (2006.01); C23C 16/06 (2006.01); C22B 23/00 (2006.01); C01G 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28061 (2013.01); C23C 16/06 (2013.01); H01L 21/76802 (2013.01); H01L 29/665 (2013.01); C01G 51/00 (2013.01); C22B 23/00 (2013.01);
Abstract

Methods for forming interconnects that include cobalt. An interconnect opening is formed in a dielectric layer that penetrates from a top surface of the dielectric layer into the dielectric layer. A first cobalt layer is formed at a bottom of the interconnect opening and partially fills the interconnect opening. A second cobalt layer is selectively deposited on the first cobalt layer and grows upwardly from the first cobalt layer at the bottom of the interconnect opening.

Find Patent Forward Citations

Lin, Sean. (2018). Cobalt interconnects formed by selective bottom-up fill (U.S. Patent No. 10109490). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10109490

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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