Koichi Motoyama

Clifton Park, NY, United States of America

Koichi Motoyama

This inventor holds 147 USPTO granted patents and 66 published patent applications and 3 EPO patents, primarily in Magneto-Resistive Memory (CPC class H01L23-5226). Top assignees: International Business Machines Corporation, Renesas Electronics Corporation, Globalfoundries Inc.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koichi Motoyama. Retrieved from https://idiyas.com/inventor/koichi-motoyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 147 

% Patents Active = 78.2

 

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 158(Granted Patents)

Forward Citations (Not Self Cited) = 121(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Kanagawa, JP (2011 - 2012)
  • Albany, NY (US) (2015)
  • Clifton Park, NY (US) (2015 - 2024)

Company Filing History:


Years Active: 2011-2026

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Areas of Expertise:
MRAM Device
Magnetic Tunnel Junction
Power Distribution Network
Top Via Interconnect
Semiconductor Structure
Nanoscale Wiring
Dielectric Plug
Copper Interconnects
Magnetoresistive Memory
Backside Power Rail
Electrode Structure
Electronic Fuse
147 patents (USPTO):Explore Patents

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I will create an article about inventor Koichi Motoyama based on the provided data.

Title: Unveiling the Genius of Inventor Koichi Motoyama

Introduction:

In the realm of semiconductor innovations, one name shines brightly - Koichi Motoyama. With a track record of 87 patents to his name, his impact on the industry is profound. Hailing from Clifton Park, NY, Motoyama's contributions have redefined electronic fuse structures and interconnect technologies.

Latest Patents:

Motoyama's latest patents showcase his expertise in cutting-edge semiconductor design:

1. "Electronic fuse structure embedded in top via" - Revolutionizing semiconductor devices with a novel method of fabrication.

2. "Top via interconnects without barrier metal between via and above line" - Enhancing interconnect efficiency and performance in semiconductor devices.

Career Highlights:

Throughout his illustrious career, Motoyama has left his mark at renowned companies such as IBM and Renesas Electronics Corporation. His innovative spirit and technical prowess have propelled the industry forward, earning him a well-deserved reputation as a trailblazer in semiconductor technologies.

Collaborations:

Collaboration has been a key aspect of Motoyama's success. Working alongside esteemed colleagues like Chih-Chao Yang and Chanro Park, he has fostered a culture of innovation and excellence. Together, they have pushed boundaries and achieved remarkable breakthroughs in semiconductor design.

Conclusion:

In conclusion, Koichi Motoyama stands as a visionary inventor whose relentless pursuit of innovation has redefined the semiconductor landscape. With a plethora of patents to his credit and a career marked by groundbreaking achievements, his legacy will continue to inspire future generations of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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