The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Jul. 26, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Chanro Park, Clifton Park, NY (US);
Koichi Motoyama, Clifton Park, NY (US);
Hsueh-Chung Chen, Cohoes, NY (US);
Yann Mignot, Slingerlands, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10P 50/00 (2026.01); H10P 76/40 (2026.01); H10W 20/43 (2026.01); H10W 20/00 (2026.01);
U.S. Cl.
CPC ...
H10P 50/71 (2026.01); H10P 76/405 (2026.01); H10P 76/4085 (2026.01); H10W 20/43 (2026.01); H10W 20/062 (2026.01);
Abstract
A substrative patterning process is provided that forms an interconnect structure including a connector tab located between two adjacent electrically conductive line structures. The connector tab and the two adjacent electrically conductive line structures are of unitary construction and are located in a same metallization level.