The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Dec. 27, 2022
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Oscar Van Der Straten, Guilderland Center, NY (US);
Koichi Motoyama, Clifton Park, NY (US);
Willie Lester Muchrison, Jr., Troy, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/76802 (2013.01); H01L 21/76846 (2013.01); H01L 21/76865 (2013.01); H01L 21/76877 (2013.01); H01L 23/5283 (2013.01); H01L 23/53295 (2013.01); H01L 23/53209 (2013.01); H01L 23/53266 (2013.01);
Abstract
A semiconductor interconnect structure and formation thereof. The semiconductor interconnect structure includes a first high aspect ratio metal line. The first high aspect ratio metal line includes a first low aspect ratio line segment and a second low aspect ratio line segment.