Tokyo, Japan

Kohei Seyama

This inventor holds 43 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Manufacturing. Top assignees: Shinkawa Ltd., Yamaha Robotics Co., Ltd., Tohoku University. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kohei Seyama. Retrieved from https://idiyas.com/inventor/kohei-seyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 43 

% Patents Active = 88.4

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 35(Granted Patents)


Company Filing History:


Years Active: 2011-2026

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Areas of Expertise:
Semiconductor Device
Mounting Apparatus
Bonding Method
Electronic Component
Manufacturing Device
Thermo-Compression
Wiring Structure
Positioning Device
Cooling Apparatus
Flip Chip Bonder
Stacking Method
Measurement Method
43 patents (USPTO):Explore Patents

Title: The Innovative Mind of Kohei Seyama

Introduction

Kohei Seyama, based in Tokyo, Japan, is a prolific inventor with a portfolio of 34 patents to his name. His work primarily focuses on the semiconductor industry, where he has developed groundbreaking technologies that enhance manufacturing processes. Seyama's inventions reflect his deep understanding of the intricacies involved in semiconductor device production.

Latest Patents

Among his latest patents is a sophisticated mounting apparatus designed to streamline the process of attaching semiconductor chips to substrates. This apparatus features a bonding stage that securely holds the substrate, a base stand, and a mounting head equipped with a pressing tool. The system is integrated with a film arranging mechanism that moves a cover film into place, ensuring optimal conditions for chip bonding. Another notable invention is a semiconductor device manufacturing device that includes a stage for substrate loading, a bonding head that bonds semiconductor chips, and a controller that independently manages the heating areas of the attachment used in the bonding head. These patents highlight Seyama's commitment to advancing semiconductor technology and improving manufacturing efficiency.

Career Highlights

Kohei Seyama has made significant contributions to the field of semiconductor manufacturing through his tenure at various esteemed companies. He has notably worked with Shinkawa Ltd. and Yamaha Motor Robotics Holdings Co., Ltd., where he utilized his expertise to innovate and improve their semiconductor processing capabilities. His experience in these organizations has played a crucial role in shaping his inventive ideas and successful patent filings.

Collaborations

Throughout his career, Seyama has collaborated with talented colleagues, including Tetsuya Utano and Yuichiro Noguchi. These partnerships have fostered an environment of creativity and knowledge sharing, further propelling his innovative endeavors in semiconductor technologies.

Conclusion

Kohei Seyama stands out as a key figure in the semiconductor industry, with his 34 patents representing a wealth of knowledge and innovation. His latest inventions demonstrate his dedication to enhancing manufacturing techniques, solidifying his legacy as an influential inventor in the field. With ongoing developments, Seyama is poised to continue making significant contributions that could reshape the future of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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