The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Aug. 20, 2020
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventor:
Kohei Seyama, Tokyo, JP;
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G03F 7/00 (2006.01); H01L 21/02 (2006.01); H01L 21/60 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67259 (2013.01); G03F 7/70433 (2013.01); G03F 7/70691 (2013.01); H01L 21/02 (2013.01); H01L 21/60 (2021.08); H01L 21/681 (2013.01);
Abstract
An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.