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Shinkawa Ltd.

USPTO Granted Patents = 136

% Expired Patents = 9.6

Forward Citations = 243

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113 inventors (with patents filed for the assignee):

Kohei Seyama (35 out of 43 patents)

Tomonori Nakamura (19 out of 25 patents)

Toru Maeda (17 out of 60 patents)

4. Tetsuya Utano (11 out of 11 patents)

5. Naoki Sekine (10 out of 18 patents)

6. Shinsuke Tei (10 out of 18 patents)

7. Shigeru Hayata (9 out of 9 patents)

8. Yuichiro Noguchi (8 out of 11 patents)

9. Yoshihito Hagiwara (8 out of 8 patents)

10. Hiroaki Yoshino (8 out of 8 patents)

11. Osamu Kakutani (8 out of 8 patents)

12. Nobuyuki Aoyagi (7 out of 11 patents)

13. Motoki Nakazawa (7 out of 7 patents)

14. Osamu Watanabe (6 out of 47 patents)

15. Shoji Wada (5 out of 15 patents)

Core Competencies:

Wire Bonding

Semiconductor Device

Bonding Apparatus

Manufacturing Method

Mounting Device

Adjustment Method

Calibration Method

Ultrasonic Horn

Resistance Wire Detection

Flux Transfer

Electronic Components

Thermal Management

136 patents: Sort by Forward Citations

1. 12431458 - Bonding device and adjustment method for bonding head (2025-09-30),

2. 12417997 - Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device (2025-09-16),

3. 12400993 - Substrate holder and bonding system (2025-08-26),

4. 12374653 - Manufacturing method of semiconductor device and wire bonding apparatus (2025-07-29),

5. 12374650 - Manufacturing apparatus and manufacturing method of semiconductor device (2025-07-29),

6. 12374563 - Semiconductor device manufacturing method (2025-07-29),

7. 12341035 - Mounting device (2025-06-24),

8. 12308273 - Bonding apparatus and method for correcting movement amount of bonding head (2025-05-20),

9. 12298358 - Resistance wire abnormality detection device (2025-05-13),

10. 12261148 - Wire bonding apparatus (2025-03-25),

11. 12217996 - Conveying device (2025-02-04),

12. 12191276 - Mounting apparatus (2025-01-07),

13. 12191173 - Wire tension adjustment method and wire tension adjuster (2025-01-07),

14. 12176317 - Semiconductor device manufacturing device and manufacturing method (2024-12-24),

15. 12145218 - Flux transfer apparatus (2024-11-19),

Shinkawa Ltd. is a leading provider of precision measurement and control systems. With over 70 years of experience, the company specializes in the development and manufacturing of advanced technologies for various industries such as semiconductor, automotive, and aerospace. Shinkawa's products include precision sensors, motion control systems, and inspection equipment. By delivering innovative solutions and maintaining high-quality standards, Shinkawa aims to contribute to the advancement of industries worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

136 Patents

#451 in Tokyo

#911 in Japan

#5,921 in the World

Shinkawa Ltd.

Forward Citations = 243

113 inventors:

Kohei Seyama (35 out of 43 patents)

Tomonori Nakamura (19 out of 25 patents)

Toru Maeda (17 out of 60 patents)

4. Tetsuya Utano (11 out of 11 patents)

5. Naoki Sekine (10 out of 18 patents)

Please report any incorrect information to [email protected]

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