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USPTO Data Jan 1 1976 - Oct 13 2026
136 Patents
#452 in Tokyo
#914 in Japan
#5,944 in the World
Shinkawa Ltd.
Forward Citations = 243
113 inventors:
Shinkawa Ltd.
% Expired Patents = 9.6
Forward Citations = 243
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113 inventors (with patents filed for the assignee):
Kohei Seyama (35 out of 43 patents)
Tomonori Nakamura (19 out of 27 patents)
Toru Maeda (17 out of 60 patents)
4. Tetsuya Utano (11 out of 11 patents)
5. Naoki Sekine (10 out of 18 patents)
6. Shinsuke Tei (10 out of 18 patents)
7. Shigeru Hayata (9 out of 9 patents)
8. Yuichiro Noguchi (8 out of 11 patents)
9. Yoshihito Hagiwara (8 out of 8 patents)
10. Hiroaki Yoshino (8 out of 8 patents)
11. Osamu Kakutani (8 out of 8 patents)
12. Nobuyuki Aoyagi (7 out of 11 patents)
13. Motoki Nakazawa (7 out of 7 patents)
14. Osamu Watanabe (6 out of 47 patents)
15. Shoji Wada (5 out of 15 patents)
Core Competencies:
Wire Bonding
Semiconductor Device
Bonding Apparatus
Manufacturing Method
Mounting Device
Adjustment Method
Calibration Method
Ultrasonic Horn
Resistance Wire Detection
Flux Transfer
Electronic Components
Thermal Management
136 patents:
5. 12374650 - Manufacturing apparatus and manufacturing method of semiconductor device (2025-07-29),
Company Overview
Shinkawa Ltd., headquartered in Tokyo, Japan, specializes in advanced wire bonding technology essential for semiconductor device manufacturing. The company focuses on developing innovative bonding apparatus and methods that enhance the efficiency and reliability of electronic component assembly. Shinkawa's expertise extends to calibration and adjustment methods, as well as ultrasonic horn technology, positioning it as a key player in the semiconductor industry. The organization is committed to advancing manufacturing processes and supporting the evolving needs of its clients.
Profile summary synthesized from public USPTO records and patent filings.
IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Shinkawa Ltd.. Retrieved from https://idiyas.com/company/shinkawa
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]