The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Jun. 07, 2021
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventors:
Toshihiko Toyama, Tokyo, JP;
Shinsuke Tei, Tokyo, JP;
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 20/00 (2006.01); B23K 20/10 (2006.01); B23K 28/02 (2014.01); H01L 25/065 (2023.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); B23K 20/005 (2013.01); B23K 20/10 (2013.01); B23K 28/02 (2013.01); H01L 24/45 (2013.01); H01L 24/78 (2013.01); H01L 25/0657 (2013.01); B23K 2101/40 (2018.08); H01L 2224/45005 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/78621 (2013.01); H01L 2224/85205 (2013.01); H01L 2225/06503 (2013.01); H01L 2924/40 (2013.01);
Abstract
A manufacturing method of a semiconductor device includes: a first step of, after joining a wire to an electrode using a capillary, forming a wire part by moving the capillary to a third target point while feeding out the wire; a second step of forming a bent part by moving the capillary to a fourth target point while feeding out the wire; a third step of processing the bent part into a planned cut part by repeating lowering and raising of the capillary for multiple times; and a fourth step of cutting the wire at the planned cut part by raising the capillary with a wire clamper closed to form a pin wire.