The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Aug. 19, 2020
Shinkawa Ltd., Tokyo, JP;
Kohei Seyama, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A bonding system () is provided with a bonding device () for bonding semiconductor chips () to individual substrates (), and a substrate holder () for holding the individual substrates (), the bonding device () being provided with a stage () for fixing, by suction, the substrate holder () on a placement surface (), the substrate holder () being provided with a plate-shaped base () and a positioning member () that is provided on the base () and that defines the position of the individual substrates (), the base () having an upper surface () on which the individual substrates () are placed and a lower surface () that is fixed by suction onto the placement surface ().