Tokyo, Japan

Shigeru Hayata

USPTO Granted Patents = 9 

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2011-2025

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9 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Shigeru Hayata

Introduction: Shigeru Hayata, based in Tokyo, Japan, is a renowned inventor known for his advancements in semiconductor technology. With a remarkable portfolio of 8 patents, Hayata has significantly contributed to the field of wire bonding apparatus.

Latest Patents: Hayata's latest inventions focus on enhancing wire bonding mechanisms, crucial for semiconductor chip assembly. His first patent describes a wire bonding apparatus that boasts a bonding stage where a semiconductor chip is mounted. This apparatus features a wire bonding unit, comprising a capillary that bonds a bonding wire to the semiconductor chip, driven by a Z-axis reciprocating section and a tool XY-stage. This design allows for precise movement in a two-dimensional plane, optimizing the bonding process. Another notable patent portrays a similar wire bonding apparatus, incorporating an XY driving mechanism that includes guides and sliders for both X and Y directions. The effective overlapping of the Y-direction guide with the bonding stage promotes a robust and efficient bonding application.

Career Highlights: Throughout his career, Hayata has worked with industry leaders such as Shinkawa Ltd. and Shinikawa Ltd., where he honed his skills in innovative device development and semiconductor engineering. His dedication and expertise have paved the way for revolutionary advancements in wire bonding technologies.

Collaborations: Collaborating with esteemed colleagues like Hiroya Yuzawa and Osamu Kakutani, Hayata has fostered a creative environment that encourages the development of new ideas and inventions. These partnerships have further propelled his contributions to the field, resulting in patents that are not only innovative but also practical for industry applications.

Conclusion: Shigeru Hayata’s contributions to the field of wire bonding apparatus exemplify the critical role inventors play in technological advancement. With his 8 patents, he not only showcases his inventive talent but also enhances the semiconductor industry's operational efficiency. Hayata’s work continues to inspire future generations of innovators.

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