The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2024
Filed:
Feb. 22, 2021
Shinkawa Ltd., Tokyo, JP;
Osamu Kakutani, Tokyo, JP;
Shigeru Hayata, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A wire bonding apparatus () includes a bonding stage (), a bonding head (), an XY driving mechanism (), and a frame (). The XY driving mechanism () includes: an X-direction guide () installed to the frame (); an X-direction slider (), supported by the X-direction guide () and moving in the X direction, an X-direction mover () being installed thereto; a Y-direction guide () installed to a lower side of the X-direction slider (); and a Y-direction slider (), supported by the Y-direction guide () and moving in the Y direction, the bonding head () being installed thereto. The XY driving mechanism () is installed to the frame (), so that a portion of the Y-direction guide () is overlapped with a mounting surface () of a bonding stage () above the mounting surface () and behind the mounting stage () in the Y direction.