Company Filing History:
Years Active: 2011-2025
Title: **Innovative Contributions of Osamu Kakutani in Bonding Technology**
Introduction
Osamu Kakutani, a notable inventor based in Tokyo, Japan, has made significant contributions to the field of bonding technology. With a total of seven patents to his name, his innovations have advanced the performance and efficiency of bonding apparatus used in various industries.
Latest Patents
Among his most recent patents is the **Bonding Apparatus and Alignment Method**. This innovative bonding apparatus features a clamper capable of securing a wire between two arms, a horn that includes a first through hole designed to accommodate a capillary, and a second through hole that penetrates the horn in a vertical direction. Additionally, the alignment method he developed allows for precise coordination between a horn and a damper of the bonding apparatus. It employs a mirror surface positioned parallel to a bonding stage to align the mirror image of the second through hole, ensuring accuracy in the bonding process.
Another significant patent is the **Wire Bonding Apparatus**, which comprises a bonding stage, bonding head, XY driving mechanism, and a robust frame. The XY driving mechanism includes a sophisticated guide and slider system that allows for intricate movements in both the X and Y directions, thus enhancing the precision of the bonding operations.
Career Highlights
Osamu Kakutani is associated with Shinkawa Ltd., a company recognized for its advancements in the automation of semiconductor manufacturing. His work not only reflects his expertise but also the innovative spirit of Shinkawa Ltd. in the field of bonding technologies.
Collaborations
Throughout his career, Kakutani has collaborated with esteemed colleagues, namely Kohei Seyama and Shigeru Hayata. Their joint efforts in research and development have further propelled advancements in bonding applications, showcasing the importance of teamwork in technological innovation.
Conclusion
Osamu Kakutani's contributions to bonding technology through his innovative patents have been instrumental in enhancing the efficiency and reliability of bonding processes. His work continues to influence the industry, making him a key figure in the landscape of modern inventions and innovations.