The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2017
Filed:
Jun. 05, 2015
Shinkawa Ltd., Tokyo, JP;
Osamu Kakutani, Tokyo, JP;
Takatoshi Kawamura, Tokyo, JP;
Kohei Seyama, Tokyo, JP;
Akira Sato, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A bonding tool cooling apparatus () provided in the vicinity of a bonding stage, including a frame (); a cooling member () including a ground plate () having a ground surface () on which a front edge surface of a bonding tool () is grounded, and a heat radiation fin () attached to an opposite surface of the ground plate () to the ground surface (), wherein the cooling member () is supported on the frame () by a support mechanism () so that the cooling member () is rotatable about two axes, i.e., an X axis extending along the ground surface () and a Y axis extending along the ground surface (). Bonding tool cooling time can be thereby reduced.