Tokyo, Japan

Takatoshi Kawamura


Average Co-Inventor Count = 1.9

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Akishima, JP (2002 - 2003)
  • Tokyo, JP (1994 - 2017)

Company Filing History:


Years Active: 1994-2017

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4 patents (USPTO):Explore Patents

Title: Takatoshi Kawamura: Innovator in Bonding Technology

Introduction

Takatoshi Kawamura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, holding a total of four patents. His innovative work focuses on improving the efficiency and effectiveness of bonding tools used in various applications.

Latest Patents

Kawamura's latest patents include a bonding tool cooling apparatus and a workpiece retainer for a bonding apparatus. The bonding tool cooling apparatus is designed to reduce cooling time by incorporating a cooling member that is rotatable about two axes. This innovative design allows for better heat management during the bonding process. The workpiece retainer features a unique design with slits that enhance the stability and positioning of workpieces, such as lead frames, during bonding operations.

Career Highlights

Throughout his career, Kawamura has worked with notable companies, including Kabushiki Kaisha Shinkawa and Shinkawa Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in bonding technology.

Collaborations

Kawamura has collaborated with esteemed colleagues, including Yoshimitsu Terakado and Tadashi Akiike. These partnerships have fostered innovation and the development of new technologies in the bonding field.

Conclusion

Takatoshi Kawamura's contributions to bonding technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in bonding processes and tools.

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