For the Inventor, By the Inventor

Enter assignee name

Kabushiki Kaisha Shinkawa

USPTO Granted Patents = 349

Forward Citations = 2,374

Loading Chart...

Loading Chart...

147 inventors (with patents filed for the assignee):

Nobuto Yamazaki (41 out of 41 patents)

Kuniyuki Takahashi (28 out of 50 patents)

Yoshimitsu Terakado (27 out of 27 patents)

4. Tatsunari Mii (26 out of 29 patents)

5. Minoru Torihata (25 out of 26 patents)

6. Tooru Mochida (22 out of 22 patents)

7. Shinichi Nishiura (21 out of 21 patents)

8. Ryuichi Kyomasu (18 out of 23 patents)

9. Hiroshi Ushiki (16 out of 22 patents)

10. Kenji Sugawara (15 out of 17 patents)

11. Kazuo Sugiura (14 out of 18 patents)

12. Osamu Nakamura (14 out of 37 patents)

13. Osamu Kakutani (12 out of 14 patents)

14. Shinji Maki (12 out of 12 patents)

15. Hijiri Hayashi (11 out of 12 patents)

Core Competencies:

Wire Bonding

Ultrasonic Horn

Semiconductor Device

Bonding Apparatus

Ball Forming Device

Imaging Device

Offset Measuring Mechanism

Bonding Control Program

Tail Wire Cutting

Bonding Pattern Discrimination

Actuator Technology

Guide Rails

349 patents: Sort by Forward Citations

1. 8678266 - Wire bonding method (2014-03-25),

2. 8511534 - Ultrasonic horn (2013-08-20),

3. 8434656 - Ultrasonic horn (2013-05-07),

4. 8283593 - Wire cleaning guide (2012-10-09),

5. 8232656 - Semiconductor device (2012-07-31),

6. 8152043 - Ultrasonic horn (2012-04-10),

7. 8143155 - Wire bonding method and semiconductor device (2012-03-27),

8. 8052026 - Ultrasonic horn (2011-11-08),

9. 7934634 - Wire bonding method (2011-05-03),

10. 7929152 - Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion (2011-04-19),

11. 7910472 - Method of manufacturing semiconductor device (2011-03-22),

12. 7893383 - Bonding apparatus and method for cleaning tip of a bonding tool (2011-02-22),

13. 7857190 - Wire bonding apparatus, record medium storing bonding control program, and bonding method (2010-12-28),

14. 7851347 - Wire bonding method and semiconductor device (2010-12-14),

15. 7848022 - Imaging device and method for a bonding apparatus (2010-12-07),

Kabushiki Kaisha Shinkawa is a Japanese mechanical engineering company that specializes in the design and manufacturing of precision motion control systems. With a focus on innovation and cutting-edge technology, Shinkawa provides advanced solutions for industries such as robotics, semiconductor manufacturing, and precision machinery. Their expertise lies in the development of high-precision sensors, motors, and control systems, which enable precise and reliable motion control in various applications. Shinkawa is committed to delivering quality products and services to meet the demanding requirements of their clients and contribute to the advancement of the industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

349 Patents

#210 in Tokyo

#464 in Japan

#2,531 in the World

Kabushiki Kaisha Shinkawa

Forward Citations = 2,374

147 inventors:

Nobuto Yamazaki (41 out of 41 patents)

Kuniyuki Takahashi (28 out of 50 patents)

Yoshimitsu Terakado (27 out of 27 patents)

4. Tatsunari Mii (26 out of 29 patents)

5. Minoru Torihata (25 out of 26 patents)

Please report any incorrect information to support@idiyas.com

Loading…