Location History:
- Kokubunji, JP (2005 - 2011)
- Tokyo, JP (1992 - 2012)
- Musashimurayama, JP (2012)
Company Filing History:
Years Active: 1992-2012
Title: Kenji Sugawara: Innovator in Bonding Technology
Introduction
Kenji Sugawara is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of bonding technology, holding a total of 17 patents. His innovative approaches have enhanced the efficiency and accuracy of bonding processes in various applications.
Latest Patents
Among his latest patents is the "Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method." This invention improves the detectability of the diameter of a pressure-bonded ball by calculating its diameter through a series of precise measurements. The method involves obtaining a first tentative radius and a second tentative radius, which are then averaged to determine the final diameter. Another notable patent is the "Bonding apparatus and bonding method," which features a control unit that manages the position of a bonding tool based on images captured by a camera. This apparatus includes components for obtaining outlines of pads and pressure-bonded balls, as well as correcting offsets based on gap lengths.
Career Highlights
Kenji Sugawara has worked with notable companies such as Kabushiki Kaisha Shinkawa and Shinkawa Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in bonding technology.
Collaborations
Throughout his career, Sugawara has collaborated with talented individuals, including Satoshi Enokido and Yong Chen. These partnerships have fostered innovation and the development of cutting-edge technologies in the bonding field.
Conclusion
Kenji Sugawara's work in bonding technology exemplifies the impact of innovative thinking in engineering. His patents and career achievements highlight his dedication to improving bonding processes, making him a significant figure in his field.