The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 1995

Filed:

Jul. 07, 1994
Applicant:
Inventor:

Kenji Sugawara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
356394 ; 356237 ; 348131 ;
Abstract

An apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: an illuminating assembly that emits lights, via LED's that are arranged in a ring-shape, onto the object of inspection such as the ball at the end of a bonded wire; an optical assembly that images the object of inspection which is illuminated by the illumination assembly, and cameras that photograph the image taken in by the optical assembly. When the ball, particularly its shape, is inspected, a dark field illumination circumstance is created by the illuminating assembly so that only the ball can appear bright. In this case, a diaphragm of the optical assembly is also adjusted so as to create a shallow focal depth for the ball.


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