The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 1995
Filed:
Dec. 01, 1992
Kenji Sugawara, Tokyo, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame including: a vertical illuminator that illuminates an object of inspection from above; an optical assembly that images particular portions of the object such as the ball at one end of a wire and the crescent at another end of the wire, by receiving the light that is emitted from the vertical illuminator and reflected by the object; a camera that photographs the image obtained by the optical assembly; and a diaphragm that is provided beneath the vertical illuminator and electrically changeable in its opening diameter. Thus, by adjusting the opening diameter of the diaphragm, clear images of the object are constantly obtained despite the differences of surface smoothness of the portions to be inspected.