Tokyo, Japan

Yoshimitsu Terakado


Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 180(Granted Patents)


Location History:

  • Hachijoji, JP (1999)
  • Hachiouji, JP (1999 - 2000)
  • Tokyo, JP (1990 - 2003)
  • Hachioji, JP (1995 - 2003)

Company Filing History:


Years Active: 1990-2003

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27 patents (USPTO):Explore Patents

Title: Innovations of Yoshimitsu Terakado in Bonding Technologies

Introduction

Yoshimitsu Terakado, an accomplished inventor based in Tokyo, Japan, holds an impressive portfolio of 27 patents. His work has significantly contributed to advancements in the field of bonding apparatus technologies, showcasing his innovative approach to improving existing methods and devices.

Latest Patents

Among his latest inventions, Terakado has developed the "Workpiece Holding Device for a Bonding Apparatus." This device features a workpiece retainer equipped with plate springs, which are designed to securely hold a workpiece during bonding operations. The unique mechanism allows plate springs to protrude beyond the retainer's surface before pressing the workpiece. When the workpiece is set in place, the springs deform elastically, ensuring a tight bond against a heat block while preventing any unwanted contact during conveyance.

Another notable invention is his "Wire Bonding Apparatus," which innovatively reduces the distance between the upper surface of the capillary and the undersurface of the clamper to 1.5 mm or less. This compact design enhances precision in wire bonding processes, showcasing Terakado's dedication to efficiency and effectiveness in his inventions.

Career Highlights

Yoshimitsu Terakado has made a significant impact through his role at Kabushiki Kaisha Shinkawa, where he continues to drive innovation in bonding technologies. His contributions have led to enhanced performance and reliability in various industrial applications.

Collaborations

Terakado works alongside esteemed colleagues such as Tooru Mochida and Nobuto Yamazaki. Together, they collaborate to refine processes and pioneering inventions that transform bonding practices within the industry, highlighting the power of teamwork in achieving groundbreaking advancements.

Conclusion

Yoshimitsu Terakado's contributions to the field of bonding technologies exemplify the spirit of innovation. With a remarkable number of patents under his name and significant advancements in his latest inventions, Terakado continues to shape the future of bonding apparatus, leaving a lasting impact on the industry. His work not only improves existing technologies but also paves the way for future innovations in the field.

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