The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 1995
Filed:
Sep. 21, 1994
Applicant:
Inventor:
Yoshimitsu Terakado, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ;
U.S. Cl.
CPC ...
219 5621 ; 228-45 ; 2281791 ;
Abstract
A wire bonding apparatus including a wire-cutting clamper and an electrical wire connection clamper which is installed above the wire-cutting clamper, the electrical wire connection clamper being electrically connected, selectively via a switch, to an electric torch power supply and a power supply used for detecting faulty wire connections.
Terakado, Yoshimitsu. (1995). Wire bonding apparatus (U.S. Patent No. 5468927). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5468927
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile