The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 16, 1996

Filed:

Jul. 30, 1993
Applicant:
Inventors:

Tooru Mochida, Tokyo, JP;

Yoshimitsu Terakado, Tokyo, JP;

Hijiri Hayashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
318 34 ; 318254 ; 219 6916 ; 219 6915 ; 228102 ;
Abstract

A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotational speed change of the Z-axis motor, and assuring a stable wire bonding.


Find Patent Forward Citations

Loading…