Kabushiki Kaisha Shinkawa

Yoshimitsu Terakado

Tooru Mochida

Nobuto Yamazaki

Kazumasa Sasakura

Shigeru Shiozawa

Tatsunari Mii

Hijiri Hayashi

Yuji Ohashi

Toru Mochida

Masayuki Seguro

Kazuo Sugiura

Shinichi Kumazawa

Akihiro Hirayanagi

Koichi Takahashi

Minoru Torihata

Hiroshi Ushiki

Tadashi Akiike

Takatoshi Kawamura

Junkichi Enomoto

Tohru Mochida

Takeshi Hasegawa

A workpiece retainer used in, for instance, a bonding apparatus for holding a workpiece during bonding being provide with plate springs that are driven towards the workpiece. Before the workpiece is pressed by the retainer, the end portions of plate springs protrude further toward the workpiece than the retaining surface of the workpiece retainer. When the workpiece is pressed by the retainer, the plate springs undergo elastic deformation and are pulled in the direction opposite from the workpiece so that the workpiece is pressed against a heat block by the retaining surface of the workpiece retainer; and when the workpiece is conveyed, the workpiece retainer is separated from the workpiece by a predetermined distance so that the plate springs undergo elastic recovery, thus preventing the workpiece from contacting the workpiece retainer.

Workpiece holding device for a bonding apparatus

In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the clamper is set as a very short distance as 1.5 mm or less.

Wire bonding apparatus

A wire bonding apparatus comprising: a spool motor rotates a spool around which a wire is wound, a tension-applying device that is disposed beneath the spool, a wire pay-out sensor disposed away from a gas-jet-out side of the tension-applying device so as to sense that the supply of the wire is insufficient, a wire-end detection sensor disposed on the gas-jet-out side of the tension-applying device so as to sense that the supply of the wire from the spool has stopped, and a control device controls so that the spool motor is rotated by a predetermined fixed amount when the wire is sensed by the wire pay-out sensor.

A wire bonding apparatus equipped with a capillary through which a wire is passed, a torch electrode which is installed in a substantially horizontally movable manner so as to be positioned beneath the capillary, and a torch electrode driver which drives the torch electrode, in which the torch electrode is directly coupled to an output shaft of a pulse motor which is driven by a high-resolution angle control circuit, so that a resolution of the pulse motor obtained by the high-resolution angle control circuit is 30,000 parts per revolution or greater.

A spool holder structure used in, for instance, a bonding apparatus and equipped with a spool holder that holds a spool around which a wire is wound, a holder shaft which is fastened to the inner circumference of the spool holder, a holder fastening shaft made of an insulating material and fastened to the inner circumference of the holder shaft, and a motor that has an output shaft fastened to the holder fastening shaft, in which the holder shaft is fastened to an attachment plate of, for instance, the bonding apparatus via a conductive bearing so that the holder shaft is rotatable, and the conductive bearing is grounded.

Spool holder structure for a wire bonder

A method for setting data for conveying a lead frame having a plurality of islands thereon to and from a bonding position of a bonding apparatus including feeding a lead frame so that the first island on the lead frame is positioned at the bonding position and the cross-hairs of a television monitor are aligned with an arbitrary position on the first island, storing the amount of feeding of the lead frame in a data memory, feeding the lead frame next so that the last island on the lead frame is positioned at the bonding position, aligning an arbitrary position on the last island which corresponds to the arbitrary position on the first island with the cross-hairs of the television camera and storing the amount of feeding of the lead frame in the data memory.

Method for setting conveying data for a lead frame

A bonding apparatus comprising a capillary through which a wire passes, a torch electrode that makes a substantially horizontal pivotal movement so as to be brought under the capillary, and a rotary motor that drives the torch electrode, thus allowing the torch electrode to have any desired range of movement so as to provide superior working characteristics.

A device and method is available for detecting abnormalities of an electric discharge generated for forming a ball at the end of a bonding wire in a bonding apparatus. A high voltage is applied across the bonding wire and an electrode, and the maximum value of the applied high voltage is detected and sent, via a peak hold circuit, to a computer that compares the maximum high voltage with an insulation breakdown voltage of a normal detection range and calculates a gap between the end of the bonding wire and the electrode, thus determining the discharge abnormalities based upon the result of the calculation of the gap.

Discharge abnormality detection device and method for use in wire

In a lead frame conveying method and apparatus used in, for instance, a wire bonding machine, a detection of the leading end of a lead frame supplied from a lead frame magazine and a positioning of the lead frame on a lead frame path are executed by a positioning sensor which is installed in the vicinity of a bonding position; and after the positioning, the lead frame is chucked by feeding claws so that a first bonding portion on the lead frame is conveyed by the feeding claws to the bonding position, thus avoiding use of the end surfaces of the feeding claws during the execution of positioning of the lead frame.

Lead frame conveying method and conveying apparatus

A data, which is used for raising-and-lowering a magazine holder on which a magazine for storing articles such as lead frames is placed in a magazine elevator device, being set by the steps of: placing a magazine on the magazine holder, storing in a memory the number of article storing sections of this magazine, aligning the lowermost article storing section of the magazine with the level of a lead frame conveying path by moving the magazine holder, storing in the memory the positional data of the thus moved magazine holder, aligning the uppermost article storing section of the magazine with the level of the frame conveying path by further moving the magazine holder, and then storing in the memory the data of the thus further moved magazine holder.

Raising-and-lowering data setting method for magazine elevator device

In a bonding method for bonding with a wire a first bonding point and then a second bonding point, a capillary that carries the wire is moved in a direction which is opposite from the first bonding point at the same time that an ultrasonic vibration is applied to the capillary during bonding to the second bonding point. Such a movement of the opposite direction can occur 10-20 ms after the application of the ultrasonic vibration at the second bonding point.

Wire bonding method

A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotational speed change of the Z-axis motor, and assuring a stable wire bonding.

Motor control circuit for a wire bonding apparatus

A wire bonding apparatus including a wire-cutting clamper and an electrical wire connection clamper which is installed above the wire-cutting clamper, the electrical wire connection clamper being electrically connected, selectively via a switch, to an electric torch power supply and a power supply used for detecting faulty wire connections.

A wire bonding method used in a bonding apparatus manufacturing, for example, semiconductor devices makes a correction of the ultrasonic output of a transducer using one of three correction timing patterns: a first correction timing pattern which makes the ultrasonic output correction prior to a first bonding by a first bonding wire to a single IC device, a second correction timing pattern which makes the output correction prior to a first bonding by a bonding wire, and a third correction timing pattern which makes the output correction prior to a first bonding and prior to a second bonding. By selecting one of the three patterns, the ultrasonic oscillation output is corrected at an appropriate timing regardless of the differences in the characteristics of the transducers used.

An apparatus for determining the polarities of bonding points to locate false bonding connections including an applied voltage output circuit which outputs positive and negative voltages, a switching circuit which after a wire is connected to a bonding point impresses voltage from the applied voltage output circuit to the bonding wire, a D/A converter which outputs standard positive and negative voltages, a polarity determining comparator which determines the polarity of the bonding point by comparing the voltage detected on the bonding wire with the standard voltage, and a memory which stores such a determination result for each bonding point.

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Tokyo, Japan

Yoshimitsu Terakado