The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2003
Filed:
Aug. 22, 2001
Applicant:
Inventors:
Yoshimitsu Terakado, Hachioji, JP;
Tooru Mochida, Higashiyamato, JP;
Tatsunari Mii, Tachikawa, JP;
Shigeru Shiozawa, Tachikawa, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/700 ; B23K 3/102 ;
U.S. Cl.
CPC ...
B23K 3/700 ; B23K 3/102 ;
Abstract
In a wire bonding apparatus in which a wire is passed through a capillary that is provided at one end of a bonding arm and a clamper that holds the wire is disposed directly above the capillary, the distance between the upper surface of the capillary and the undersurface of the clamper is set as a very short distance as 1.5 mm or less.