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For the Inventor, By the Inventor

Kodaira, Japan

Ryuichi Kyomasu

USPTO Granted Patents = 23

Average Co-Inventor Count = 2.6

ph-index = 10

Forward Citations = 205(Granted Patents)


Location History:

  • Tokyo, JP (1994 - 1995)
  • Kodaira, JP (1982 - 2005)

Company Filing History:

goldMedal18 out of 349 
 
Kabushiki Kaisha Shinkawa
 patents
silverMedal4 out of 42,485 
 
Hitachi, Ltd.
 patents
bronzeMedal1 out of 1 
 
Hitachi Tokyo Electronics
 patent
4. 1 out of 211 
 
Kulicke and Soffa Industries, Inc.
 patents
5. 1 out of 1 
 
Hitachi Tokyo Engineering Co., Ltd.
 patent
where one patent can have more than one assignee

Years Active: 1982-2005

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23 patents (USPTO):Explore Patents
1. 6871772 - Wire bonding apparatus (2005-03-29),
2. 6863206 - Bonding apparatus (2005-03-08),
3. 6814121 - Bonding apparatus (2004-11-09),
4. 6766936 - Transducer and a bonding apparatus using the same (2004-07-27),
5. 6762848 - Offset measurement method, tool position detection method and bonding apparatus (2004-07-13),
6. 6727666 - XY table for a semiconductor manufacturing apparatus (2004-04-27),
7. 6719183 - Transducer and a bonding apparatus using the same (2004-04-13),
8. 6491202 - Wire bonding apparatus and method (2002-12-10),
9. 6467679 - Wire bonding method (2002-10-22),
10. 6467673 - Bonding apparatus and bonding method (2002-10-22),
11. 6464126 - Bonding apparatus and bonding method (2002-10-15),
12. 6449516 - Bonding method and apparatus (2002-09-10),
13. 6422448 - Ultrasonic horn for a bonding apparatus (2002-07-23),
14. 6189761 - Wire bonding apparatus (2001-02-20),
15. 6135338 - Capillary holding structure for ultrasonic horn (2000-10-24),

As an AI assistant specializing in innovations, inventions, inventors, patent attorneys, assignees, and patents, I'd be pleased to assist you with an article about the esteemed inventor, Ryuichi Kyomasu, from Kodaira, JP.

Title: Innovator Extraordinaire - A Glimpse into the World of Ryuichi Kyomasu

Introduction:

Ryuichi Kyomasu, a visionary inventor hailing from Kodaira, JP, has made significant contributions to the realm of innovation with a remarkable portfolio of 23 patents to his name. His groundbreaking work and dedication to excellence have left an indelible mark on the world of technology.

Latest Patents:

One of his latest patents includes a Wire Bonding Apparatus, revolutionizing the wire bonding process through the integration of cutting-edge technologies such as ultrasonic transducers and impact detection sensors. Another notable invention is the Bonding Apparatus, showcasing his ingenuity in designing intricate systems for industrial applications.

Career Highlights:

Throughout his illustrious career, Ryuichi Kyomasu has held pivotal roles at renowned companies such as Shinkawa and Hitachi, Ltd., where he has spearheaded numerous projects and innovative solutions. His expertise and innovative spirit have propelled him to the forefront of the industry.

Collaborations:

Collaborating with industry experts such as Shigeru Hayata and Satoshi Enokido, Ryuichi Kyomasu has fostered a culture of innovation and collaboration, bringing together diverse talents to drive forward groundbreaking projects and advancements in the field of technology.

Conclusion:

In conclusion, Ryuichi Kyomasu stands as a true pioneer in the world of innovation, constantly pushing the envelope to create a better future for all. His relentless pursuit of excellence and unwavering dedication to his craft continue to inspire generations of inventors and creators worldwide.

I hope this article provides valuable insights into the remarkable work of inventor Ryuichi Kyomasu.

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