Kabushiki Kaisha Shinkawa

Hitachi, Ltd.

Kulicke and Soffa Industries, Inc.

Hitachi Tokyo Electronics

Hitachi Tokyo Engineering Co., Ltd.

Ryuichi Kyomasu

Satoshi Enokido

Shigeru Hayata

Toshiaki Sasano

Osamu Kakutani

Nobuhiro Takasugi

Kenji Watanabe

Nobuto Yamazaki

Tsutomu Mimata

Mitsuaki Sakakura

Fumio Miyano

Minoru Kawagishi

Toshihiko Toyama

Tadashi Akiike

Yoshihiko Seino

Isamu Yamazaki

Kuniyuki Takahashi

Minoru Torihata

Shinichi Nishiura

Yutaka Kondo

Yasushi Suzuki

Shuichi Hanashima

Motohiko Kato

Yoshikazu Suzumura

Toshimichi Miyahara

Hiroto Urabayashi

Toshiki Yoshida

Toshihiro Satoh

A wire bonding apparatus with a bonding head that includes an ultrasonic transducer having a capillary at its tip end, piezo-electric elements that form a pair of complementary action type extension and retraction driving elements which cause the ultrasonic transducer to move with respect to a transducer holder, an impact detection sensor, and a Z motor which drives the transducer holder. The piezo-electric elements are arranged so that when one of them is driven to extend, the other is driven to retract. When the impact detection sensor detects that the capillary is lowered by the Z motor and comes into contact with a bonding object (semiconductor chip), the driving of the Z motor is stopped, and the piezo-electric elements are driven to the directions of extension and retraction in a complementary manner, thus swinging the ultrasonic transducer and moving the capillary upward.

Wire bonding apparatus

A bonding apparatus including an ultrasonic horn having a capillary, a horn holder holding the ultrasonic horn, a swing arm rotatably supporting the horn holder on horn holder supporting shafts, and auxiliary arms which are rotatably supported by auxiliary arm supporting shafts and rotatably supported by connecting shafts on the horn holder. The horn holder supporting shafts are disposed above a hypothetical center of an imaginary horizontal line extending from the tip end of the capillary, the auxiliary arm supporting shafts are disposed in the back of the horn holder supporting shafts and at the same height as the horn holder supporting shafts, and the connecting shafts are disposed at an intersection of an extension of an imaginary line connecting the tip end of the capillary and the horn holder supporting shafts and an extension of an imaginary line connecting the hypothetical center and the auxiliary arm supporting shafts.

Bonding apparatus

In measuring the position of a bonding tool accurately in offset correction in a bonding apparatus, the tool is moved to approach a reference member, the tool is illuminated with a reference pattern by a laser diode, and the deviation between the reference member and tool in one horizontal direction is measured based upon the image of the reference pattern projected on the tool. A position detection camera images the tool in another horizontal direction, thus measuring the deviation of the tool and reference member. The position detection camera is moved to approach the reference member, and the deviation between the position detection camera and the reference member is measured by the position detection camera. The accurate offset amounts between the position detection camera and the tool are determined based upon these measured values and amounts of movement of the position detection camera and the tool.

A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions and connecting portions. The holding portions are provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and the connecting portions each connects the tip ends of two protruding holding portions to each other. The external force applied to one of the holding portions is thus dispersed in each of the respective holding portions connected by the connecting portions, deformation of the holding portions is prevented, and the respective holding portions can be formed extremely thin in the axial direction of the transducer main body.

Transducer and a bonding apparatus using the same

Offset measurement method, tool position detection method and bonding apparatus

An XY table used in a semiconductor manufacturing apparatus including lower (X table) fixed to an X movable element and an upper table (Y table) fixed to a Y movable element, in which the upper table (Y table) is supported movably in a Y direction and immovably in an X direction on the lower table (X table), the X movable element is immovable in the Y direction with respect to the X motor main body, the Y movable element is movable in the X direction with respect to the Y motor main body. Furthermore, the Y motor main body is provided with a permanent magnet that covers an entire region of movement of a magnetic action component (coils) of the Y movable element in the X direction.

XY table for a semiconductor manufacturing apparatus

A transducer vibrated by a vibrator and used in a bonding apparatus, the transducer including holding portions provided so as to protrude at at least two locations that correspond to the nodes of vibration of a transducer main body, and connecting portions each connecting the tip ends of two protruding holding portions to each other. The transducer main body, holding portions and connecting portions are integrally formed from a single material member.

A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.

Wire bonding apparatus and method

Wire bonding method and apparatus in which axial center of a bonding tool is brought to a reference member, and light-emitting diodes are sequentially lit so that images of the reference member and bonding tool in the X and Y directions are acquired by an offset correction camera. In this way, the amount of deviation between the bonding tool and the reference member is measured. Then, a position detection camera is caused to approach the reference member, and the amount of deviation between the optical axis of the position detection camera and the reference member is measured by the position detection camera. The accurate offset amount are determined on the basis of these measured values and the amounts of movement.

Bonding apparatus and bonding method

Wire bonding method

A wire bonding apparatus and method in which an axial center of a bonding tool is moved to the vicinity of a near reference member, laser diodes are sequentially lit, images of the reference member and bonding tool in the horizontal directions are acquired by a position detection camera, and amounts of deviation between the tool and the reference member are measured. Then, the position detection camera is caused to approach the reference member, and amounts of deviation between the optical axis of the position detection camera and the reference member are measured by the position detection camera. The accurate offset amounts are determined from the measured values and amounts of movement. Image light of the tool and reference member is conducted to the position detection camera by prisms and half-mirror, without a camera for detecting the amount of deviation between the tool and reference member.

In a bonding method and apparatus, a position-detecting camera is moved to a point above reference marks, and the positional relationship between the reference marks and the optical axis of the position-detecting camera is measured by the position-detecting camera, a bonding tool is moved to a point above the reference marks in accordance with an amount of offset stored in memory beforehand, the positional relationships between the reference marks and the tool are measured by an offset-correcting camera, and an accurate amount of offset is determined by correcting the mount of offset stored in memory beforehand based upon such a measurement result.

Bonding method and apparatus

An ultrasonic horn used in, for instance, a bonding apparatus, being provided with a capillary attachment hole formed so as to be smaller than the capillary and a jig insertion hole that communicates with the capillary attachment hole. By way of inserting a jig into the jig insertion hole, the jig insertion hole is pushed open that causes the capillary attachment hole to be widened, so that the capillary is inserted and received in this enlarged capillary attachment hole. The capillary is fastened in place by the elastic force that is generated when the capillary attachment hole returns to its original shape, and the capillary is held in the horn main body without using any fastening tools.

Ultrasonic horn for a bonding apparatus

A ultrasonic horn attached to a bonding arm of a bonding apparatus via two horn supporting members. These horn supporting members, preferably made from a resin material, are separate components from the ultrasonic horn, and the ultrasonic horn and the two horn supporting members are provided so that their positional relationship in the axial direction of the ultrasonic horn can be adjusted.

An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.

Growing community of inventors

Kodaira, Japan

Ryuichi Kyomasu