The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2014
Filed:
Feb. 24, 2006
Tatsunari Mii, Tachikawa, JP;
Toshihiko Toyama, Tokorozawa, JP;
Tatsunari Mii, Tachikawa, JP;
Toshihiko Toyama, Tokorozawa, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A wire bonding method for bonding a ballwhich is formed at a tip end of a bonding wire to a padthat is a first bond point to form a first bonding partand bonding the wireto an interconnect wiringthat is a second bond point to form a second bonding part, thus connecting the padand the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillaryis ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.