Tokorozawa, Japan

Toshihiko Toyama


Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 153(Granted Patents)


Location History:

  • Musashimurayama, JP (2002)
  • Tokorozawa, JP (2009 - 2014)

Company Filing History:


Years Active: 2002-2014

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6 patents (USPTO):Explore Patents

Title: The Innovations of Toshihiko Toyama

Introduction

Toshihiko Toyama is a notable inventor based in Tokorozawa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work focuses on improving bonding methods and manufacturing processes in semiconductor devices.

Latest Patents

One of Toyama's latest patents is a wire bonding method. This method involves bonding a ball formed at the tip end of a bonding wire to a pad, which serves as the first bond point, to create a first bonding part. The wire is then bonded to an interconnect wiring, acting as a second bond point, to form a second bonding part. This process connects the pad and the interconnect wiring with the wire. After the ball is bonded to the first bond point, a capillary ascends, and an examination is performed to detect any bonding failures at the first bonding part. If a bonding failure is found, the capillary descends to execute bonding at the first bond point.

Another significant patent is related to the method of manufacturing semiconductor devices. This innovation enhances the bondability between a wire and a bump, as well as the cutting property of the wire, thereby improving bonding quality. In this semiconductor device, a wire is stacked on a pad to form a bump with a sloped wedge and a first bent wire convex portion. The wire is looped from a lead to the bump and pressed against the sloped wedge with the tip end of a capillary to bond the wire. Simultaneously, the wire is pressed to the first bent wire convex portion using an inner chamfer of a bonding wire hole in the capillary, creating a wire bent portion with a bow-shaped cross-section. The wire is then pulled up and cut at the wire bent portion.

Career Highlights

Toshihiko Toyama is currently employed at Kabushiki Kaisha Shinkawa, where he continues to innovate in the semiconductor field. His work has significantly impacted the efficiency and quality of semiconductor manufacturing processes.

Collaborations

Throughout his career, Toyama has collaborated with talented individuals such as Tatsunari Mii and Hiroaki Yoshino. These collaborations have fostered a creative environment that has led to numerous advancements in their field.

Conclusion

Toshihiko Toyama's contributions to semiconductor technology

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