Kabushiki Kaisha Shinkawa

Toshihiko Toyama

Tatsunari Mii

Ryuichi Kyomasu

Fumio Miyano

Hiroaki Yoshino

Horoaki Yoshino

A wire bonding method for bonding a ballwhich is formed at a tip end of a bonding wire to a padthat is a first bond point to form a first bonding partand bonding the wireto an interconnect wiringthat is a second bond point to form a second bonding part, thus connecting the padand the interconnect wiring with the wire, wherein after the ball is bonded to the first bond point and a capillaryis ascended, examination is performed to find any bonding failure of the first bonding part; and when the bonding failure at the first bond point is found, then the capillary is caused to descend to execute bonding to bond the first bonding part to the first bond point.

Wire bonding method

A semiconductor device with improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality. In the semiconductor device, a wire is stacked on a pad as a second bonding point to form a bump having a sloped wedge and a first bent wire convex portion, and a wire is looped from a lead as a first bonding point to the bump and is pressed to the sloped wedge of the bump with a face portion of a tip end of a capillary to bond the wire to the bump. At the same time, the wire is pressed to the first bent wire convex portion using an inner chamfer of a bonding wire hole in the capillary to form a wire bent portion having a bow-shaped cross section. The wire is pulled up and cut at the wire bent portion.

Method of manufacturing semiconductor device

Semiconductor device and wire bonding method

A wire bonding method including the steps of: descending a capillaryfrom above an external leadto press a wireto such an extent that the wire is not completely connected to the external lead, thus forming a thin partin the wire; next ascending the capillaryand the thin partto substantially the same height as a first bonding point A, then moving the capillaryin a direction away from the first bonding point A, thus making a linear wire portionand then cutting the wire at the thin part; then connecting the end(thin part) of the linear wire portionand the wire tip endat the lower end of the capillaryare connected to the external lead; and then separating the wire tip endfrom the external lead

A wire bonding apparatus equipped with a chip heating assembly which is installed above a heater block that contains heaters so as to heat the chip portion of a device such as a semiconductor device, and a cooling pipe which is installed in the heater block so as to cool the heater block. The temperature of the bonding surface of the device is maintained by the chip heating assembly at a temperature that allows bonding to be executed while the heater block is cooled by cooling water or a cooling air draft that flows through the cooling pipe so that the temperature of the heater block is maintained at a low temperature that cause no softening of the resin substrate of the device.

Growing community of inventors

Tokorozawa, Japan

Toshihiko Toyama